Description
Compound to increase the thermal conductivity and the efficient heat dissipation of electronic components.
Pack dimensions 150x10x50mm
Contents 20g
Where Sound Meets Visuals
Where Sound Meets Visuals
£7.99 Excluding VAT
Heat Sink Compound 20g
High thermal conductivity
Excellent moisture buffer
Low metallic impurity content
Compound to increase the thermal conductivity and the efficient heat dissipation of electronic components.
Pack dimensions 150x10x50mm
Contents 20g
| Weight | 0.15 kg |
|---|
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